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印制电路词汇

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印制电路词汇

 

 

 

 

 

 

  1. 综合词汇
    1
    印制电路:printed circuit
    2
    印制线路:printed wiring
    3
    印制板:printed board
    4
    印制板电路:printed circuit board (PCB)
    5
    印制线路板:printed wiring board(PWB)
    6
    印制元件:printed component
    7
    印制接点:printed contact
    8
    印制板装配:printed board assembly
    9
    板:board

  2. 10
    单面印制板:single-sided printed board(SSB)
    11
    双面印制板:double-sided printed board(DSB)
    12
    多层印制板:mulitlayer printed board(MLB)
    13
    多层印制电路板:mulitlayer printed circuit board
    14
    多层印制线路板:mulitlayer prited wiring board
    15
    刚性印制板:rigid printed board
    16
    刚性单面印制板:rigid single-sided printed borad
    17
    刚性双面印制板:rigid double-sided printed borad
    18
    刚性多层印制板:rigid multilayer printed board
    19
    挠性多层印制板:flexible multilayer printed board
    20
    挠性印制板:flexible printed board
    21
    挠性单面印制板:flexible single-sided printed board
    22
    挠性双面印制板:flexible double-sided printed board
    23
    挠性印制电路:flexible printed circuit (FPC)
    24
    挠性印制线路:flexible printed wiring
    25
    刚性印制板:flex-rigid printed board, rigid-flex printed board
    26
    刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed
    27
    刚性多层印制板:flex-rigid multilayer printed board, rigid-flex multilayer printed board
    28
    齐平印制板:flush printed board
    29
    金属芯印制板:metal core printed board
    30
    金属基印制板:metal base printed board
    31
    多重布线印制板:mulit-wiring printed board
    32
    陶瓷印制板:ceramic substrate printed board
    33
    导电胶印制板:electroconductive paste printed board
    34
    模塑电路板:molded circuit board

  3. 35
    模压印制板:stamped printed wiring board
    36
    顺序层压多层印制板:sequentially-laminated mulitlayer
    37
    散线印制板:discrete wiring board
    38
    微线印制板:micro wire board
    39
    积层印制板:buile-up printed board
    40
    积层多层印制板:build-up mulitlayer printed board (BUM)
    41
    积层挠印制板:build-up flexible printed board
    42
    表面层合电路板:surface laminar circuit (SLC)
    43
    埋入凸块连印制板:B2it printed board
    44
    多层膜基板:multi-layered film substrate(MFS)
    45
    层间全内导通多层印制板:ALIVH multilayer printed board
    46
    载芯片板:chip on board (COB)
    47
    埋电阻板:buried resistance board
    48
    母板:mother board
    49
    子板:daughter board
    50
    背板:backplane
    51
    裸板:bare board
    52
    键盘板夹心板:copper-invar-copper board
    53
    动态挠性板:dynamic flex board
    静态挠性板:static flex board

  4. 55
    可断拼板:break-away planel
    56
    电缆:cable
    57
    挠性扁平电缆:flexible flat cable (FFC)
    58
    薄膜开关:membrane switch
    59
    混合电路:hybrid circuit
    60
    厚膜:thick film
    61
    厚膜电路:thick film circuit
    62
    薄膜:thin film
    63
    薄膜混合电路:thin film hybrid circuit
    互连:interconnection
    65
    导线:conductor trace line
    66
    齐平导线:flush conductor
    67
    传输线:transmission line
    68
    跨交:crossover
    69
    板边插头:edge-board contact
    70
    增强板:stiffener
    71
    基底:substrate
    72
    基板面:real estate
    73
    导线面:conductor side
    74
    元件面:component side
    75
    焊接面:solder side
    76
    印制:printing
    77
    网格:grid
    78
    图形:pattern
    79
    导电图形:conductive pattern
    80
    非导电图形:non-conductive pattern
    81
    字符:legend
    82
    标志:mark
    二、 基材:

    1
    基材:base material
    2
    层压板:laminate
    3
    覆金属箔基材:metal-clad bade material
    4
    覆铜箔层压板:copper-clad laminate (CCL)
    5
    单面覆铜箔层压板:single-sided copper-clad laminate
    6
    双面覆铜箔层压板:double-sided copper-clad laminate
    7
    复合层压板:composite laminate
    8
    薄层压板:thin laminate
    9
    金属芯覆铜箔层压板:metal core copper-clad laminate
    10
    金属基覆铜层压板:metal base copper-clad laminate
    11
    挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film

  5. 12
    基体材料:basis material
    13
    预浸材料:prepreg
    14
    粘结片:bonding sheet
    15
    预浸粘结片:preimpregnated bonding sheer
    16
    环氧玻璃基板:epoxy glass substrate
    17
    加成法用层压板:laminate for additive process
    18
    预制内层覆箔板:mass lamination panel
    19
    内层芯板:core material
    20
    催化板材:catalyzed board ,coated catalyzed laminate
    21
    涂胶催化层压板:adhesive-coated catalyzed laminate
    22
    涂胶无催层压板:adhesive-coated uncatalyzed laminate
    23
    粘结层:bonding layer
    24
    粘结膜:film adhesive
    25
    涂胶粘剂绝缘薄膜:adhesive coated dielectric film
    26
    无支撑胶粘剂膜:unsupported adhesive film
    27
    覆盖层:cover layer (cover lay)
    28
    增强板材:stiffener material
    29
    铜箔面:copper-clad surface
    30
    去铜箔面:foil removal surface
    31
    层压板面:unclad laminate surface
    32
    基膜面:base film surface
    33
    胶粘剂面:adhesive faec
    34
    原始光洁面:plate finish

  6. 35
    粗面:matt finish
    36
    纵向:length wise direction
    37
    模向:cross wise direction
    38
    剪切板:cut to size panel
    39
    酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
    40
    环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
    41
    环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates
    42
    环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
    43
    环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates
    44
    聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates
    45
    聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates
    46
    双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
    47
    环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates
    48
    聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates
    49
    超薄型层压板:ultra thin laminate
    50
    陶瓷基覆铜箔板:ceramics base copper-clad laminates
    51
    紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates

    三、 基材的材料

    1
    A阶树脂:A-stage resin
    2
    B阶树脂:B-stage resin
    3
    C阶树脂:C-stage resin
    4
    环氧树脂:epoxy resin
    5
    酚醛树脂:phenolic resin
    6
    聚酯树脂:polyester resin
    7
    聚酰亚胺树脂:polyimide resin
    8
    双马来酰亚胺三嗪树脂:bismaleimide-triazine resin
    9
    丙烯酸树脂:acrylic resin
    10
    三聚氰胺甲醛树脂:melamine formaldehyde resin
    11
    多官能环氧树脂:polyfunctional epoxy resin
    12
    溴化环氧树脂:brominated epoxy resin
    13
    环氧酚醛:epoxy novolac
    14
    氟树脂:fluroresin
    15
    硅树脂:silicone resin
    16
    硅烷:silane
    17
    聚合物:polymer
    18
    无定形聚合物:amorphous polymer
    19
    结晶现象:crystalline polamer
    20
    双晶现象:dimorphism
    21
    共聚物:copolymer
    22
    合成树脂:synthetic
    23
    热固性树脂:thermosetting resin
    24
    热塑性树脂:thermoplastic resin
    25
    感光性树脂:photosensitive resin
    26
    环氧当量:weight per epoxy equivalent (WPE)
    27
    环氧值:epoxy value
    28
    双氰胺:dicyandiamide
    29
    粘结剂:binder
    30
    胶粘剂:adesive
    31
    固化剂:curing agent
    32
    阻燃剂:flame retardant
    33
    遮光剂:opaquer
    34
    增塑剂:plasticizers
    35
    不饱和聚酯:unsatuiated polyester
    36
    聚酯薄膜:polyester
    37
    聚酰亚胺薄膜:polyimide film (PI)
    38
    聚四氟乙烯:polytetrafluoetylene (PTFE)
    39
    聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film (FEP)
    40
    增强材料:reinforcing material
    41
    玻璃纤维:glass fiber
    42
    E玻璃纤维:E-glass fibre
    43
    D玻璃纤维:D-glass fibre
    44
    S玻璃纤维:S-glass fibre
    45
    玻璃布:glass fabric
    46
    非织布:non-woven fabric
    47
    玻璃纤维垫:glass mats
    48
    纱线:yarn
    49
    单丝:filament
    50
    绞股:strand
    51
    纬纱:weft yarn
    52
    经纱:warp yarn
    53
    但尼尔:denier
    经向:warp-wise
    55
    纬向:weft-wise, filling-wise
    56
    织物经纬密度:thread count
    57
    织物组织:weave structure
    58
    平纹组织:plain structure
    59
    坏布:grey fabric
    60
    稀松织物:woven scrim
    61
    弓纬:bow of weave
    62
    断经:end missing
    63
    缺纬:mis-picks
    纬斜:bias
    65
    折痕:crease
    66
    云织:waviness
    67
    鱼眼:fish eye
    68
    毛圈长:feather length
    69
    厚薄段:mark
    70
    裂缝:split
    71
    捻度:twist of yarn
    72
    浸润剂含量:size content
    73
    浸润剂残留量:size residue
    74
    处理剂含量:finish level
    75
    浸润剂:size
    76
    偶联剂:couplint agent
    77
    处理织物:finished fabric
    78
    聚酰胺纤维:polyarmide fiber
    79
    聚酯纤维非织布:non-woven polyester fabric
    80
    浸渍绝缘纵纸:impregnating insulation paper
    81
    聚芳酰胺纤维纸:aromatic polyamide paper
    82
    断裂长:breaking length
    83
    吸水高度:height of capillary rise
    84
    湿强度保留率:wet strength retention
    85
    白度:whitenness
    86
    陶瓷:ceramics
    87
    导电箔:conductive foil
    88
    铜箔:copper foil
    电解铜箔:electrodeposited copper foil (ED copper foil)
    90
    压延铜箔:rolled copper

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