7.4 Amps, 600/650 Volts
N-CHANNEL POWER MOSFET
DESCRIPTION
Power MOSFET 7N60
The UTC 7N60 is a high voltage MOSFET and is designed to
have better characteristics, such as fast switching time, low gate charge, low on-state resistance and have a high rugged avalanche characteristics. This power MOSFET is usually used at high speed switching applications in switching power supplies and adaptors.
FEATURES
Lead-free: 7N60L Halogen-free: 7N60G
* RDS(ON) = 1.0Ω @VGS = 10 V
* Ultra low gate charge (typical 29 nC )
* Low reverse transfer Capacitance ( CRSS = typical 16pF ) * Fast switching capability * Avalanche energy tested
* Improved dv/dt capability, high ruggedness
SYMBOL
2.Drain1.Gate
3.Source
ORDERING INFORMATION
Ordering Number Pin Assignment
Package Packing
Normal Lead Free Plating Halogen Free 1 2 3 7N60-x-TA3-T 7N60L-x-TA3-T 7N60G-x-TA3-T TO-220 G D S Tube 7N60-x-TF1-T 7N60L-x-TF1-T 7N60G-x-TF1-T TO-220F1 G D S Tube 7N60-x-TF3-T 7N60L-x-TF3-T 7N60G-x-TF3-T TO-220F G D S Tube Note: Pin Assignment: G: Gate D: Drain S: Source
7N60L-x-TA3-T(1)Packing Type(2)Package Type(3)Drain-Source Voltage(4)Lead Plating(1) T: Tube(2) TA3: TO-220, TF1: TO220-F1, TF3: TO-220F(3) A: 600V, B: 650V(4) G: Halogen Free, L: Lead Free, Blank: Pb/Sn www.unisonic.com.tw
Copyright © 2009 Unisonic Technologies Co., Ltd
1 of 7
QW-R502-076,E
7N60 Power MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25°C, unless otherwise specified)
PARAMETER SYMBOL RATINGS UNIT 7N60-A 600 V Drain-Source Voltage VDSS
7N60-B 650 V Gate-Source Voltage VGSS ±30 V Avalanche Current (Note 2) IAR 7.4 A Continuous ID 7.4 A Drain Current
A Pulsed (Note 2) IDM 29.6 Single Pulsed (Note 3)EAS 530 mJ Avalanche Energy
Repetitive (Note 2) EAR 14.2 mJ Peak Diode Recovery dv/dt (Note 4) dv/dt 4.5 V/ns
TO-220 142 W Power Dissipation PD
TO-220F/TO-220F1 48 W Junction Temperature TJ +150 °C Storage Temperature TSTG -55 ~ +150 °C Notes: 1. Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
2. Repetitive Rating : Pulse width limited by maximum junction temperature 3. L = 19.5mH, IAS = 7.4A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C 4. ISD ≤ 7.4A, di/dt ≤ 200A/μs, VDD ≤ BVDSS, Starting TJ = 25°C
THERMAL DATA
PARAMETER SYMBOL RATINGS UNIT TO-220 62.5 °C/W Junction to Ambient θJA
TO-220F/TO-220F162.5 °C/W TO-220 0.88 °C/W Junction to Case θJC
TO-220F/TO-220F12.6 °C/W ELECTRICAL CHARACTERISTICS (TC =25°C, unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAXUNIT
OFF CHARACTERISTICS
7N60-A 600 V
Drain-Source Breakdown Voltage BVDSS VGS = 0V, ID = 250μA
7N60-B 650 V
Drain-Source Leakage Current IDSS VDS = 600V, VGS = 0V 1 μA
Forward VGS = 30V, VDS = 0V 100nA
Gate- Source Leakage Current IGSS
Reverse VGS = -30V, VDS = 0V -100nA
Breakdown Voltage Temperature I = 250μA,
△BVDSS/△TJD 0.67 V/°C
Coefficient Referenced to 25°C ON CHARACTERISTICS Gate Threshold Voltage VGS(TH) VDS = VGS, ID = 250μA 2.0 4.0VStatic Drain-Source On-State Resistance RDS(ON) VGS = 10V, ID = 3.7A 1.0ΩDYNAMIC CHARACTERISTICS Input Capacitance CISS 1400pF
VDS=25V, VGS=0V, f=1.0 MHzOutput Capacitance COSS 180pF
16 21pFReverse Transfer Capacitance CRSS
SWITCHING CHARACTERISTICS Turn-On Delay Time tD(ON) 70nsTurn-On Rise Time tR 170nsVDD =300V, ID =7.4A, RG =25Ω
(Note 1, 2) Turn-Off Delay Time tD(OFF) 140ns
130nsTurn-Off Fall Time tF
Total Gate Charge QG 29 38nC
VDS=480V, ID=7.4A, VGS=10 V
Gate-Source Charge QGS 7 nC
(Note 1, 2)
14.5 nCGate-Drain Charge QGD
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ELECTRICAL CHARACTERISTICS(Cont.)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAXUNIT
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS Drain-Source Diode Forward Voltage VSD VGS = 0V, IS = 7.4 A 1.4V
Maximum Continuous Drain-Source Diode
IS 7.4A
Forward Current
Maximum Pulsed Drain-Source Diode
ISM 29.6A
Forward Current
VGS = 0V, IS = 7.4 A, Reverse Recovery Time tRR 320 nsdIF / dt = 100A/μs (Note 1) 2.4 μCReverse Recovery Charge QRR
Notes: 1. Pulse Test: Pulse width ≤ 300μs, Duty cycle ≤ 2% 2. Essentially independent of operating temperature
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D.U.T.+VDS-+-LTEST CIRCUITS AND WAVEFORMS
RGDriverVGSSame Type as D.U.T.*dv/dt controlled by RG* ISD controlled by pulse period* D.U.T.-Device Under TestVDD
Fig. 1A Peak Diode Recovery dv/dt Test Circuit
VGS(Driver)
PeriodP.W.D=P. W.PeriodVGS=10VIFM, Body Diode Forward CurrentISD(D.U.T.)
IRMBody Diode Reverse Currentdi/dtBody Diode Recovery dv/dtVDS(D.U.T.)
VDDBody Diode
Forward Voltage Drop
Fig. 1B Peak Diode Recovery dv/dt Waveforms
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TEST CIRCUITS AND WAVEFORMS (Cont.)
Fig. 2A Switching Test Circuit Fig. 2B Switching Waveforms
Fig. 3A Gate Charge Test Circuit Fig. 3B Gate Charge Waveform
L
VDSBVDSS
IASRGVDD
D.U.T.tptpTimeVDDID(t)VDS(t)10V
Fig. 4A Unclamped Inductive Switching Test Circuit Fig. 4B Unclamped Inductive Switching Waveforms
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TYPICAL CHARACTERISTICS
On-Region Characteristics
VGSTop: 15.0V 10.0V101 8.0V 7.0V 6.5V 6.0V Bottorm:5.5VTransfer Characteristics
Drain Current, ID(A)100
*Notes:1. 250µs Pulse Test2.TC=25°C100101Drain-Source Voltage, VDS(V)
Drain Current, ID (A)101
100
150°C25°C-55°CNotes:1. VDS=50V 2.250µs Pulse Test681010-110-110-124Gate-Source Voltage, VGS(V)
Drain-Source On-Resistance, RDS(ON) (Ω)
Capacitance (pF)ID, Drain Current (A)ReverseDrain Current, IDR(A)
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TYPICAL CHARACTERISTICS(Cont.)
UTC assumes no responsibility for equipment failures that result from using products at values thatexceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, orother parameters) listed in products specifications of any and all UTC products described or containedherein. UTC products are not designed for use in life support appliances, devices or systems wheremalfunction of these products can be reasonably expected to result in personal injury. Reproduction inwhole or in part is prohibited without the prior written consent of the copyright owner. The informationpresented in this document does not form part of any quotation or contract, is believed to be accurateand reliable and may be changed without notice.
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