SOLAR CELL PACKAGE STRUCTURE WITH CIRCUIT DESIGN

专利名称：SOLAR CELL PACKAGE STRUCTURE WITH

CIRCUIT DESIGN

发明人：Chj-Don TENG,Kuang-Feng CHUNG申请号：US13346489申请日：20120109

公开号：US20130081689A1公开日：20130404

专利附图：

摘要：A solar cell package structure with a circuit design includes a first conductivesubstrate, a second conductive substrate, a first conductive wire and a second conductivewire. The second conductive substrate is disposed opposite to the first conductive

substrate. The first conductive wire is electrically connected to the first conductivesubstrate through a first conductive via. The second conductive wire is electricallyconnected to the second conductive substrate through a second conductive via.

申请人：Chj-Don TENG,Kuang-Feng CHUNG

地址：Taipei City TW,Taipei City TW

国籍：TW,TW

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