专利名称：RECONFIGURABLE PROCESSOR MODULE
COMPRISING HYBRID STACKEDINTEGRATED CIRCUIT DIE ELEMENTS
发明人：HUPPENTHAL, JON, M.,GUZY, JAMES, D.申请号：EP02789540申请日：20021108公开号：EP1461715A4公开日：20070801
摘要：A reconfigurable processor module (60) comprising hybrid stacked integratedcircuit 'IC' die elements. In a particular embodiment disclosed herein, a processor modulewith reconfigurable capability may be constructed by stacking one or more thinnedmicroprocessor (64), memory (66) and/or field programmable gate array 'FPGA' die (68)elements and interconnecting the same utilizing contacts that traverse the thickness ofthe die. The processor module disclosed allows for a significant acceleration in thesharing of data between the microprocessor and the FPGA element while advantageouslyincreasing final assembly yield and concomitantly reducing final assembly cost.
申请人：ARBOR COMPANY LLP
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