专利名称：METHOD OF MANUFACTURING AN
ASSEMBLY AND ASSEMBLY
发明人：DE HAAS, Wilhelmus, H.,MICHIELSEN,
Theodorus, M.,SCHOOFS, Franciscus, A., C.,M.,VAN VEEN, Nicolaas, . J., A.,DEKKER,Ronald,DE SAMBER, Marc, A.
申请号：EP06765833.6申请日：20060623公开号：EP1900018A2公开日：20080319
摘要：The assembly (100) comprises a laterally limited semiconductor substrateregion (15) in which an electrical element (20) is defined. Thereon, an interconnectstructure (21) is present. This is provided, at its first side (101) with contact pads (25,26)for coupling to an electric device (30), and at its second side (102) with connections (20) tothe electrical element (11). Terminals (52,53) are present at the second side (102) of theinterconnect structure (21), and coupled to the interconnect structure (21) throughextensions (22,23) that are laterally displaced and isolated from the semiconductorsubstrate region (15). An electric device (30) is assembled to the first side (101) of theinterconnect structure (21), and an encapsulation (40) extending on the first side (101) ofthe interconnect structure (21) so as to support it and encapsulating the electric device(30) is present.
申请人：Koninklijke Philips Electronics N.V.
地址：Groenewoudseweg 1 5621 BA Eindhoven NL
国籍：NL
代理机构：Schouten, Marcus Maria
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