专利名称：Manufacturing method for a composite
device
发明人：Yohichi Okumura申请号：US09179913申请日：19981027公开号：US06355578B1公开日：20020312
专利附图：
摘要：To offer a technique that can form electrodes in a composite device withoutusing a lift-off method. In the manufacture of a composite device in which a wafer that hasa sacrificial layer is used, a mask film that has been patterned is formed; patterning is
given to a structural layer , the sacrificial layer is etched from the area that is exposed, amovable part is formed in an area where said sacrificial layer is removed, and a fixed partis formed in an area where the sacrificial layer remains; also, a thin metallic film is formedand patterning is given before forming the mask film , with electrodes for an externalelectrical connection being formed. A protective film thin titanium tungsten film isformed on the surface of said thin metallic film , with the thin metallic film beingprotected during etching of the sacrificial layer . It can be done without using a lift-offmethod, and the thin film wiring and the electrodes can also be formed from the samethin metallic film
申请人：TEXAS INSTRUMENTS INCORPORATED
代理人：Bret J. Petersen,Frederick J. Telecky, Jr.
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