专利名称：System and method for performing
simultaneous precision die bond of photoniccomponents onto a single substrate
发明人：Dale L. Capewell申请号：US10260792申请日：20020930公开号：US06974168B2公开日：20051213
专利附图：
摘要：Embodiments of the present invention overcome the disadvantages of themetal bond head systems while also providing a method for performing precision die
bond of multiple die at once. A mounting system is adapted for simultaneous highaccuracy placement of multiple semiconductor components or dies on substrates.Simultaneous high accuracy multiple die placement is achieved by providing a mountinghead assembly, including a see-through (ST) bond head with selectively andindependently controlled gripping mechanisms, with moving and/or adjusting
mechanisms adapted for accurate alignment of semiconductor components relative to asubstrate in all directions.
申请人：Dale L. Capewell
地址：Agoura Hills CA US
国籍：US
代理机构：Pillsbury Winthrop Shaw Pittman LLP
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