专利名称:Articles comprising metal-coated polymeric
substrates and process
发明人:Hiei Ando,Dale E. Hall申请号:US06/944281申请日:19861218公开号:US04783243A公开日:19881108
摘要:Improved articles are disclosed having a polymeric substrate containing apolymer, such as polyamide, and a metallic sulfide, such as copper sulfide, and a thin,uniform, and firmly adherent overlayer of an eletrodepositable metal, such as nickel. Themetal overlayer may be continuous or selectively patterned over the polymericsubstrate. The metal layer provides the articles with decorative, protective andelectrically conductive characteristics without significantly diminishing polymericproperties.
申请人:AMERICAN CYANAMID COMPANY
代理人:Michael J. Kelly,Steven H. Flynn
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