METHOD AND SYSTEMS FOR COUPLING SEMICONDUCTOR SUBS

专利名称：METHOD AND SYSTEMS FOR COUPLING

SEMICONDUCTOR SUBSTRATES

发明人：Richard E. Bornfreund,Joseph H. Durham申请号：US15287636申请日：20161006

公开号：US201700253A1公开日：20170126

专利附图：

摘要：Systems and methods may be provided for coupling together semiconductordevices. One or more of the semiconductor devices may be provided with an array ofbump contacts formed in an etch back process. The bump contacts may be indium

bumps. The indium bumps may be formed by depositing a sheet of indium onto a surfaceof a device substrate, depositing and patterning a layer of photoresist over the indiumlayer, and selectively etching the indium layer to the surface of the substrate using thepatterned photoresist layer to form the indium bumps. The substrate may be an infrareddetector substrate. The infrared detector substrate may be coupled to a readoutintegrated circuit substrate using the bumps.

申请人：FLIR Systems, Inc.

地址：Wilsonville OR US

国籍：US

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