Method including an adjustment of a plurality of w

专利名称：Method including an adjustment of a

plurality of wafer handling elements, systemincluding a plurality of wafer handlingelements and photolithography track

发明人：Heiko Wagner,Sidheswara Mahapatra申请号：US15176296申请日：20160608公开号：US10007198B2公开日：20180626

专利附图：

摘要：A method includes providing a semiconductor processing system that includes a

plurality of units. Each unit has a configuration that defines a predetermined orientationof a wafer that is provided in the unit and includes a plurality of wafer handling elements.An arrangement of the plurality of wafer handling elements of the unit relative to thepredetermined orientation of the wafer is adjustable. For each of the plurality of units,the arrangement of the plurality of wafer handling elements of the unit is adjustedrelative to the predetermined orientation of the wafer. For each of the plurality of units,an arrangement of the plurality of wafer handling elements relative to thepredetermined orientation of the wafer is provided that is different from the

arrangement of the plurality of wafer handling elements relative to the predeterminedorientation of the wafer in one or more other units of the plurality of units.

申请人：GLOBALFOUNDRIES Inc.

地址：Grand Cayman KY

国籍：KY

代理机构：Amerson Law Firm, PLLC

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