线路板公司全英文的PFEMA

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

P/N: (10000017104)/Rev. A Customer :Item : CutingFMEA No. : FMEA-BC-01Process Responsibility : Drilling Dept.Repared by : FMEA Date (Orig.) :Aug 8th 2004Approved by : Core Team : Page : 1 of 14Rev. : DProcessFunctionRequirements1 IQCIQCCheck thematerial toensure thematerial meetthe qualityrequirementsPotentialFailureModePotentialEffect(s) ofFailureCPotentialOSlCause(s)/ceaMechanism(s)cvsof Failureusr6The operator is not4familiar with theirwork .or the Personis not very cercon onthe work .CurrentProcessControlsDeR.RecommendedtP.Action(s)eN.c72Responsibility& TargetCompletionDateAction ResultsActionsTakenSODR.eceP.vctN.omit finding outeffect the quality ofthe defeat of thePCB or the processmaterialtraining the person and3check their work once aweekPOTENTIAL

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

P/N: 10000017104)/Rev. A Customer :Item : CutingFMEA No. : FMEA-BC-01Process Responsibility : Drilling Dept.Repared by : FMEA Date (Orig.) :Aug 8th 2004Approved by :Core Team : Page : 2 of 14Rev. : DProcessFunctionRequirements2 Cutinglaminate·Cutting laminateas requireddimensionPotentialFailureModePotentialEffect(s) ofFailureCPotentialOSlCause(s)/ceaMechanism(s)cvsof FailureusrNot clarify infor-mation due to carelessoperationCurrentProcessControlsDeR.RecommendedtP.Action(s)eN.c372NoneResponsibility& TargetCompletionDateAction ResultsActionsTakenSODR.eceP.vctN.Wrong material:Wrong material used83According MIrequirement andcheck withlaminate labelbefore cutting·Wrong basiccopper foil thickness·Wrong laminatematerialwill be scrap·Laminatethickness outof requirementPOTENTIAL

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

P/N: (10000017104)/Rev. A Customer :Item : DrillingFMEA No. : DR-BProcess Responsibility : Drilling Dept.Repared by :FMEA Date (Orig.) :Aug 8th 2004Approved by : Core Team : Page : 3 of 14Rev. : DProcessFunctionRequirements3 DrillDrilling PTHholes, Comp.holes and Tooling holeson laminatePotentialFailureModeHole shiftPotentialEffect(s) ofFailure·Broken Pad·Affect componentinsertionprocessCPotentialOSlCause(s)/ceaMechanism(s)cvsof Failureusr7·Machine Failure·Laminate stackingtoo many for drilling·Wrong datumsettingHole shift inprogramCurrentProcessControlsDeR.RecommendedtP.Action(s)eN.c363NoneResponsibility& TargetCompletionDateAction ResultsActionsTakenSODR.eceP.vctN.3Full check thelowest piece of each stack at each cycle2QA checkingTemplate3·Check drill bit sizebefore use and check hole sizefor each cycle·Set the resharpfrequency and 342NoneHole size out·Via holes no problem7of requirement·Difficult for comp.(larger, smaller)insertion·For tooling, regis-tration holes that willaffect alignmentBurrsaccuracyMetal protrudedfrom the edge of holes, affect holesize after plating5preparation·Wrong drill bit size·Drill bit wearingduring process242NoneChips on drill bitcutting facelife time2New and resharped drill bits must be visual check afterreceived or used4Resharp frequencyaccording instruction330NoneNot sharp480100% check the bit.And use magnifier.Completing it before10,4,2004Drilling workship53345POTENTIAL

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

P/N: 10000017104Rev. D Customer :Item :PTHFMEA No. : FMEA-EP-CProcess Responsibility : Plating Dept.Repared by : FMEA Date (Orig.)Aug 8th ,2004Approved by : Core Team : Page : 4 of 14Rev. : D4PTH and panelplatingProcessFunctionRequirementsPotentialFailureModePotentialEffect(s) ofFailureCPotentialOSlCause(s)/ceaMechanism(s)cvsof FailureusrCurrentProcessControlsDeR.RecommendedtP.Action(s)eN.c484Responsibility& TargetCompletionDateAction ResultsActionsTakenSODR.eceP.vctN.EletcrolessdepositNo copper or·Can not connectboth side caue open7*Rough on hole wallor chips block inholes3In-line QC checktwice per shift 1,random checkingIPQC. Apr,10,2004.According to AQL Checking according7To AQL=1.0 7The leader observeThe surface of boards2228a layer of coppervoid in holesinside the holes toconnect both sidesmetal·Cause scrap orreworkIn activation processthe Pa/Sn compoundattach on holes quantity is lowAcceleration processtoo long Bubble trap in holes2Laboratory checkthe bath tempera-ture and composi-tion level once pershift2Analysis solution once per shift andreplenish3·Air vibrate6g checking program: 96Plating workship.The leader observe the surface March,30,2004.When the boards are dragged up From the tank6961,checking the temperature Plating workship.Of acceleration tank per fMarch,30,2004.342 2342Checkingthe tank 7Temperature per Four hours.2342·Mechanicakvibrate POTENTIAL

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

P/N: (10000017104)/Rev. A Customer :Item :PTHFMEA No. : FMEA-EP-CProcess Responsibility : Plating Dept.Repared by :FMEA Date (Orig.) :Aug 8th 2004Approved by : Core Team : Page : 5 of 14Rev. : DProcessFunctionRequirementsPotentialFailureModePotentialEffect(s) ofFailureCPotentialOSlCause(s)/ceaMechanism(s)cvsof FailureusrCopper ions are notactiveCurrentProcessControlsDeR.RecommendedtP.Action(s)eN.cResponsibility& TargetCompletionDateAction ResultsActionsTakenSODR.eceP.vctN.723422·Laboratory checkcopper thickness once per shiftreplenishment4 1,adding the methodThe ME dep.finishing it onDoing the fiber Of checking:doing the fibMarch 15,2004 .Testing once per shiftTesting once perShift.·Automatic solution232 Activator solutionlevel too lowElectroless copper 2Randomly line auditto check solution level2Overflow opening232348NoneNoneDeposit coppernot completely combine withbase copper orno copper deposit·Cause of platingpeel off7solution level too lowcontrol solution levelImproper racking that 2Foreman respondspart of boards overto check workers solution levelhandling·Cleaner not3·laboratory analysiscompletely removegreasedegrease and mildetch composition not less than onetime per shift4481,adding the method of checkingDoing micro-etch rate oncePer shift.the ME dep.finishing73342·Increase reworkloading·Unenough wild etch·According totalsquare feet to makeup new degrease bathIt on March,30,2004.·According copperions conc. to change mild etchsolutionPOTENTIAL

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

P/N:(10000017104)/Rev. A Customer :Item : Panel PlatingFMEA No. : FMEA-EP-CProcess Responsibility : Plating Dept.Repared by :FMEA Date (Orig.) :Aug 8th 2004Approved by : Core Team :Page : 6 of 14Rev. : DProcessFunctionRequirementsAdding copperthicknessof holes andbase copperthickness by electricial platingPotentialFailureModePotentialEffect(s) ofFailureCPotentialOSlCause(s)/ceaMechanism(s)cvsof Failureusr·Low concentrationof copper ionsCurrentProcessControlsDeR.RecommendedtP.Action(s)eN.c224NoneResponsibility& TargetCompletionDateAction ResultsActionsTakenSODR.eceP.vctN.BurnRough plating copper6layer peel off andcopper too thick that increase nextprocess difficulty:2·Doing Hull celltest twice per weekin laboratory·Insufficientbrightener·Analysis solutioncomposition containonce per week·Difficult to printingsolder mask·Affect hole size·Wrong current setting3·Audit workeroperate3None·Too large currentsupply·Specified personfor current settingUnenough copper thickness·Cause void in mildetch state6*·Wrong current setting3·Too low currentsupply·According F.A. tosetting current byspecified person3None·Affect plate throughquality·Foreman auditrandomlyActual current output3is less than metershown·Affect solderability·production checkactual current output weekly,3NonePOTENTIAL

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

P/N: (10000017104)/Rev. A Customer :Item : Image MovingFMEA No. :IM-AProcess Responsibility : Imaging Dept.Repared by :FMEA Date (Orig.) : Aug 8th 2004Approved by :Core Team : Page : 7 of 14Rev. : DProcessFunctionRequirements5 Imagetransfer Transfer the epattern to the board from the filmPotentialFailureModePotentialEffect(s) ofFailureCPotentialOSlCause(s)/ceaMechanism(s)cvsof FailureusrCurrentProcessControlsDeR.RecommendedtP.Action(s)eN.cResponsibility& TargetCompletionDateAction ResultsActionsTakenSODR.eceP.vctN.instruction to change a new one.Unenough vacuum power3·Check vacuumpressure beforeexposure3None ·Routine check forvacuum systemUnder developDry film residues 6remain on coppersurface to cause poorplating or underetchingParameters out of control range:temperature or spraypressure orconcentration ofdevelop solution;break pointOver exposure3·Check the tempe-rature pressure andconcentration whennew make up236None·Check the breakpoint for each 300panels pass through2Do stouffer testonce per 4 hours and record result236NoneToo much foam insidedeveloping solution, cause2If too much foam isformed, add 1~2 cover of defoamer336Nonespray pressure low downPOTENTIAL

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

P/N: (10000017104)/Rev. A Customer :Item : Pattern PlatingFMEA No. : FMEA-PP-02Process Responsibility : Plating Dept.Repared by :FMEA Date (Orig.) : Aug 8th 2004Approved by : Core Team : Page :8 of 14 Rev. : dProcessFunctionRequirements6 PatternplatingPotentialFailureModePotentialEffect(s) ofFailureCPotentialOSlCause(s)/ceaMechanism(s)cvsof Failureus6*Over current apply orplating time too longCurrentProcessControlsDeR.RecommendedtP.Action(s)eN.c3NoneResponsibility& TargetCompletionDateAction ResultsActionsTakenSODR.eceP.vctN.r3·According FA to setting current andtime·Foreman audit worker operation·Use timer to controlplating time and auto alarmUneven distribution of current, certain portion over currentsupply3Check and cleanconnection areaTo addt the copperPlating too thick·Copper layer overthickness of thecustomer design holethickness·Cause of hole undersize that difficultlyinsert component·Increase solder maskprinting difficulty·Conductor edgestrap of dry film5721. To add dummyEngineering Dept.copper on to theTechnical Dept.breakaway or thearea which is near tothe circult in thepanel to balance the2004.4.30current;3NoneCopper ions containis too high in solutionor anode area larger than cathode3·Analysis plating solution once per week·Even arrange ofboard and full load on plating bath P/N: (10000017104)/Rev. A Customer :Item : EtchingFMEA No. :EP-DPOTENTIAL

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

FMEA Date (Orig.) :Aug 8th 2004Approved by :Core Team : Page : 9 of 14Rev. : DProcess Responsibility : Plating Dept.Repared by : ProcessFunctionRequirements7 Ethcing to Use copperetching solutionto remove copperout of image pattern, thenremain needed circuitriesPotentialFailureModeIncompleteetchPotentialEffect(s) ofFailure·Cause of conductorover size and alsoshort circuit·Increase QC reworkloading·Increase work loadfor re-etchingCPotentialOSlCause(s)/ceaMechanism(s)cvsof Failureusr6Copper remain onboard edges undernormal etch speed due to uneven thickness from edge to centreCurrentProcessControlsDeR.RecommendedtP.Action(s)eN.c3 None Responsibility& TargetCompletionDateAction ResultsActionsTaken SODR.eceP.vctN.3·Use double racksfor plating and clean freight barfrequentlyEtching speed too fast3·According linewidth to adjustconveyor speedToo low of etchanttemperature2·Thermostat controltemperature; fore-man audit once per4 hours; QA auditat least twice pershiftInsufficient spraypressure or nozzlesare blocked3·Check nozzles before productiondaily3None 3None3NonePOTENTIAL

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

P/N: (10000017104)/Rev. A Customer Item : HASLFMEA No. : HA-01Process Responsibility : HASL Dept.Repared by : FMEA Date (Orig.) : Aug 8th 2004Approved by : Core Team :Page : 10 of 14Rev. : DProcessFunctionRequirements8 HALPotentialFailureModePotentialEffect(s) ofFailureCPotentialOSlCause(s)/ceaMechanism(s)cvsof FailureusrAir knives too closeto board surfaceCurrentProcessControlsDeR.RecommendedtP.Action(s)eN.c336NoneResponsibility& TargetCompletionDateAction ResultsActionsTakenSODR.eceP.vctN.Cover a layer ofThin solderTin/Lead alloy oncopper surface andhole wallSolder layer easy6oxide, matt color, andlow solderability2·Trial each modelfor HAL result accept before prod.·QC check surfaceafter HALRising up speed tooslow·Easy cause solderThick solderfilament short, affecthole size·Difficult insertcomponentRising up speed toofastUneven solderthickness·Thin solder area easy6oxidation, matt color,low solderability·Thick solder area easy cause solder filament short, affecthole size6Air knives too faraway from boardsurface3adjust proper rising up speed forHAL machine3·Trial each part number for HALresult accept beforeproduction·QC check surfaceafter HAL3Adjust properrising up speed forHAL machine336None336None336NoneUnclean on air knives3Clean air knivesor blocked withforeign materialDue to laminate thinor warp/bent ofboard3Check before prod.,inform related person if board hassevere warpagerandomly3None336NonePOTENTIAL

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

P/N: (10000017104)/Rev. A Customer :Item : ProfilingFMEA No. : OU-BProcess Responsibility : Profiling Dept.Repared by : FMEA Date (Orig.) :Aug 8th 2004Approved by Core Team : Page : 11 of 14Rev. : CProcessFunctionRequirements9 RoutingFollow customerrequest outlinedimension, usingCNC routing machine and v-cutting machineto finish PCB as requirementPotentialFailureModeOutline dimen-sion out of specificationPotentialEffect(s) ofFailureCause of difficultlyor cannot assemblyin customer side,affect assembly process cause rejectCPotentialOSlCause(s)/ceaMechanism(s)cvsof Failureusr8Use wrong route bit,too small or too largeCurrentProcessControlsDeR.RecommendedtP.Action(s)eN.c348NoneResponsibility& TargetCompletionDateAction ResultsActionsTakenSODR.eceP.vctN.2Routing templatemust be checked by ME and QA,start production after result is pass2Compare first punch with MIsample and recordpunching quantity3sampling check6 times per lot byoperator, QA checkbefore productionAfter long period ofusage, wearing of punch die causedimension changeFixer shiftV-score shiftDimension out ofspecification or broken circuitrycause scrap8580Control the use lifeof router,and beforeProduction Dept. QAuse, prodcutionDept.worker mustmeasure its size toensure the size is2004.4.30372NoneV-score too shallow or toodeep·Easy broken whentoo deep·Difficult broken when too shallow·Customer unsatisfy6V-score knives wearing due to long time usage or improper cuttingdepth adjustmentMix board in production process4First piece checkedby QA when start,check 6 times for each lot randomly372Nonedue to inconvenienceMissing V-scoreUnable to saparate7the individual board2Specify area for storage separaterouted and waitingfor route areaAdd v-cut test570coupon on to thebreakaway of panelEngineering Dept.and the panel which2004.4.30is not v-cut will befound by E/T tester.POTENTIAL

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

P/N:（ 10000017104)/Rev. C Customer :Item : Electrical TestFMEA No. : E/T-AProcess Responsibility : E-test Dept.Repared by : FMEA Date (Orig.) :Aug 8th 2004Approved by : Core Team : Page : 12 of 14Rev. :DProcessFunctionRequirements10 E-testTest the oepn and short tofinding theproblem boardPotentialFailureModePotentialEffect(s) ofFailureCPotentialOSlCause(s)/ceaMechanism(s)cvsof FailureusrMissing point in fixtureCurrentProcessControlsDeR.RecommendedtP.Action(s)eN.c348NoneResponsibility& TargetCompletionDateAction ResultsActionsTakenSODR.eceP.vctN.2.Cross checking filmafter marking pointsby two staffs.Check and record3Check of E-Testfixture isolate pointbefore installation and record2According learn fisture informationto check isolatepoint beforeproduction8·Wrong test pininsertion·Missing test pinsCannot identify fixture pass or not372None348NoneMissing E-TestprocessOpen/short PCBmay be sent tocustomer8Wrong stationtransported by workers2·Specified personfor transportation·Follow lot card process flow to transport PCB3Specified personassign for checking348NoneLabel on boardUnsatisfied visualperformance may cause of returned orcomplained by customer5Missing remove labelafter rework230NonePOTENTIAL

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

P/N:(10000017104)/Rev. A Customer :Item : CutingFMEA No. : FMEA-BC-01Process Responsibility : Drilling Dept.Repared by : FMEA Date (Orig.) : Aug 8th 2004Approved by : Core Team :Page : 13 of 14Rev. : DProcessFunctionRequirements11 FQCCheck thefinshed boardqualityPotentialFailureModePotentialEffect(s) ofFailureCPotentialOSlCause(s)/ceaMechanism(s)cvsof Failureusr6The operator is not4familiar with theirwork .or the Personis not very cercon onthe work .CurrentProcessControlsDeR.RecommendedtP.Action(s)eN.c72Responsibility& TargetCompletionDateAction ResultsActionsTakenSODR.eceP.vctN.omit finding outeffect the quality ofthe defeat of thePCB or the processmaterialtraining the person and3check their work once aweekPOTENTIAL

FAILURE MODE AND EFFECTS ANALYSIS

(PROCESS FMEA)

P/N: MA3395-6116(1000017104)/Rev. A Customer :Item : PackingFMEA No. : QC-ACore Team :Process Responsibility : Packing Dept.Repared by : FMEA Date (Orig.) : Jul.14th, 2002 (Rev.): Apr.8th, 2004Approved by :Page : 14 of 14Rev. : DProcessFunctionRequirements12 Packing According customer requirement to pack PCBPotentialFailureModeIncorrect packing quantityPotentialEffect(s) ofFailureCPotentialOSlCause(s)/ceaMechanism(s)cvsof Failureusr·Caused by carelessoperationCurrentProcessControlsDeR.RecommendedtP.Action(s)eN.c230NoneResponsibility& TargetCompletionDateAction ResultsActionsTakenSODR.eceP.vctN.·Customer unsatisfy5for product's packing·Affect customer'sproduction plan3·Audit workers operatingQA checkingprocess by C=0,AQL II 1.5after packingMix with otherpart numberMix with other P/Ncause customerunsatisfactory andreject7·Incorrect handling·Mix lot card2·Foreman auditworkers handlingemployed fortransportation andcheck lot card342 3None Wrong customerCustomer unsatisfypart numberfor wrong P/N on packing6Improper operate by3·Foreman audit worker who write the workers operatingwrong numberand check the label·Line audit randomlyNone