专利名称：TAB tape for semiconductor package发明人：Dong Han Kim,Hyoung Ho Kim申请号：US10359080申请日：20030206公开号：US06853090B2公开日：20050208
专利附图：
摘要：A TAB tape for a semiconductor package is provided. The TAB tape providesnumber of test pad configuration for reducing the area of the test pad area on a TABtape to increases the number of packages that may be prepared from a length of TABtape. The TAB tape comprises a base film having a chip mounting area for mounting at
least one semiconductor device and a wiring pattern formed on the base film with testpads formed at the ends of the output terminal patterns. A predetermined number ofthe test pads are arranged in rows form a group wherein the number of rows is less thanthe number of test pads in the group. Groups of the test pads are consecutivelyarranged across the TAB tape to provide the number of test pads necessary for testingthe semiconductor device(s).
申请人：Dong Han Kim,Hyoung Ho Kim
地址：Osan KR,Anyang KR
国籍：KR,KR
代理机构：Harness, Dickey & Pierce, P.L.C.
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