Packaging structure and method

专利名称：Packaging structure and method发明人：Nazir Ahmad,Young-Do Kweon,Samuel

Tam,Kyung-Moon Kim,Rajendra D. Pendse

申请号：US114444申请日：20060601

公开号：US200602574A1公开日：20061116

专利附图：

摘要：A method for forming metallurgical interconnections and polymer adhesion ofa flip chip to a substrate includes providing a chip having a set of bumps formed on abump side thereof and a substrate having a set of interconnect points on a metallization

thereon, providing a measured quantity of a polymer adhesive in a middle region of thechip on the bump side, aligning the chip with the substrate so that the set of bumpsaligns with the set of interconnect points, pressing the chip and the substrate toward oneanother so that a portion of the polymer adhesive contacts the substrate and the bumpscontact the interconnect points, and heating the bumps to a temperature sufficientlyhigh to form a metallurgical connection between the bumps and the interconnect points.Also, a flip chip package is made by the method. In some embodiments the metallurgicalconnection includes an alloy of gold and tin at the interface between the bumps and theinterconnect points.

申请人：Nazir Ahmad,Young-Do Kweon,Samuel Tam,Kyung-Moon Kim,Rajendra D.Pendse

地址：San Jose CA US,Cupertino CA US,Dale City CA US,Ichon-si KR,Fremont CA US

国籍：US,US,US,KR,US

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