专利名称：ADHESIVE COMPOSITION AND ADHESION
METHOD
发明人：Yuki Hisha,Kimihiko Yoda,Kazuhiro Oshima申请号：US13122020申请日：20091008
公开号：US20110190414A1公开日：20110804
摘要：Disclosed is an adhesive composition having adhesion properties, high-speedcuring properties and moisture resistance. Also disclosed is an adhesion method.Specifically disclosed is a composition which comprises: a first preparation comprising (A)a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (C) a compound having an enalstructure, and (F) a radical polymerization initiator; and a second preparation comprising(A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (D) a compound having anamine structure, and (E) a compound containing copper. Also disclosed is a compositionwhich comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a(meth)acrylic composition, (D) a compound having an amine structure, and (F) a radicalpolymerization initiator; and a second preparation comprising (A) a nitrile-butadienerubber, (B) a (meth)acrylic composition, (C) a compound having an enal structure, and (E) acompound containing copper.
申请人：Yuki Hisha,Kimihiko Yoda,Kazuhiro Oshima
地址：Gunma JP,Gunma JP,Gunma JP
国籍：JP,JP,JP
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