专利名称：Encapsulation of multiple integrated circuits发明人：Tiao Zhou申请号：US10291263申请日：20021108
公开号：US20040089955A1公开日：20040513
专利附图：
摘要：In one embodiment, a device includes but is not limited to: a first integratedcircuit affixed to a substrate; an electronic circuit component affixed to the substrate; afirst encapsulation structure encasing the first integrated circuit; a second integratedcircuit affixed to the first encapsulation structure; and a second encapsulation structure
which at least partially encases the first encapsulation structure, the first integratedcircuit, and the electronic component.
申请人：STMICROELECTRONICS, INC.
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