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Manufacturing method of conductive material

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专利名称:Manufacturing method of conductive

material

发明人:西村 直哉,香西 孝章申请号:JP2019148536申请日:20190813公开号:JP2020170696A公开日:20201015

摘要:Problem to be solved: to provide a method of manufacturing a conductivematerial capable of obtaining a conductive material excellent in time stability. Aconductor characterized in that a conductive peripheral metal portion of a conductivematerial having at least a light transmissive conductive layer and a conductive peripheralmetal portion on the support is treated with at least a nonaqueous resin dispersion and atreatment solution containing at least a polyhydroxy benzene and / or its derivativeMethod of manufacturing material. No selection

申请人:三菱製紙株式会社

地址:東京都墨田区両国二丁目10番14号

国籍:JP

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