专利名称：Spectra based endpointing for chemical
mechanical polishing
发明人：Boguslaw A. Swedek,Dominic J.
Benvegnu,Jeffrey D. David
申请号：US12182076申请日：20080729公开号：US08088298B2公开日：20120103
专利附图：
摘要：Methods and apparatus for spectrum-based endpointing. An endpointingmethod includes selecting two or more reference spectra. Each reference spectrum is a
spectrum of white light reflected from a film of interest on a first substrate and has athickness greater than a target thickness. The reference spectra is selected for particularspectra-based endpoint determination logic so that the target thickness is achieved whenendpoint is called by applying the particular spectra-based endpoint logic. The methodincludes obtaining two or more current spectra. Each current spectrum is a spectrum ofwhite light reflected from a film of interest on a second substrate when the film ofinterest is being subjected to a polishing step and has a current thickness that is greaterthan the target thickness. The method includes determining, for the second substrate,when an endpoint of the polishing step has been achieved.
申请人：Boguslaw A. Swedek,Dominic J. Benvegnu,Jeffrey D. David
地址：Cupertino CA US,La Honda CA US,San Jose CA US
国籍：US,US,US
代理机构：Fish & Richardson P.C.
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