SEMICONDUCTOR DEVICES WITH CLOSE-PACKED VIA STRUCT

专利名称：SEMICONDUCTOR DEVICES WITH CLOSE-PACKED VIA STRUCTURES HAVING IN-PLANE ROUTING AND METHOD OF MAKINGSAME

发明人：EBEFORS, THORBJÖRN,PERTTU, DANIEL申请号：EP13760504申请日：20130312公开号：EP2826066A4公开日：20151216

摘要：The invention relates to a semiconductor structure, comprising a substrate (10)of a semiconductor material having a first side (FS) and an opposite second side (BS).There is at least one conductive wafer-through via (V) comprising metal, and at least onerecess (RDL) provided in the first side of the substrate and in the semiconductor materialof the substrate. The recess is filled with metal (27) and seamlessly connected with thewafer-through via. The exposed surfaces of the metal filled via and the metal filled recessare essentially flush with the substrate surface on the first side of the substrate. There isalso provide an interposer comprising the above structure, further comprising contactsfor attaching circuit boards and integrated circuits on opposite sides of the interposer. Amethod of making the structure is also provided.

申请人：SILEX MICROSYSTEMS AB

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