专利名称：Method of encapsulating a device based on
organic semiconductors
发明人：LANGER, ALFRED,MESSNER, EKKEHARD, DR.申请号：EP03009335.5申请日：20030424公开号：EP1359628A2公开日：20031105
专利附图：
摘要：An encapsulation process for a component based on an organic semiconductoruses a glass solder (6) of similar coefficient of thermal expansion to the substrate (2) andhousing, mixes it with binder or solvent, seals the cover (5), removes the solvent, sinters
and heats the glass locally using light of a given wavelength. An encapsulation processfor a component based on an organic semiconductor comprises preparing a housing withconnections using substrate (2), housing and glass solder (6) having thermal coefficientsof expansion differing by less than 10e-6/K. The glass is mixed with a binder or solvent,sealed around the cover (5), the binder or solvent removed, the glass sintered and thesubstrate covered with the semiconductor component (3) and electrode layers (4,12). Thecover (5) is applied and the glass locally heated by a light source at a given peakwavelength.
申请人：PATENT-TREUHAND-GESELLSCHAFT FUER ELEKTRISCHE GLUEHLAMPEN MBH
地址：Hellabrunner Strasse 1 81543 München DE
国籍：DE
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