专利名称：Encapsulant material applicator for
semiconductor wafers and method of usethereof
发明人：Ken Pham,Nikhil Vishwanath Kelkar,Vivek
Kishorechand Arora
申请号：US09715358申请日：20001117公开号：US06730170B1公开日：20040504
专利附图：
摘要：An encapsulant applicator comprising a flexor formed of a resilient material and
a substantially rigid blade is described. The blade is attached to the flexor in a way thatduring a smoothing process, a force applied through the flexor is distributed across thesecond edge of the blade. Another aspect of the invention pertains to a system forforming a substantially uniform layer of material on a surface of a semiconductor wafer.The system of the present invention includes a stencil, an applicator and a conveyordevice. The stencil is placed over the surface of the wafer so that an opening in the stencilexposes a portion of the surface of the wafer. The conveyor device is connected to theflexor so that during the smoothing process, the conveyor device moves the applicatoracross the opening of the stencil. Yet another aspect of the invention pertains to amethod for applying a substantially uniform layer of flowable material to a surface of asemiconductor wafer using the applicator as described.
申请人：NATIONAL SEMICONDUCTOR CORPORATION
代理机构：Beyer Weaver & Thomas, LLP
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