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Method of manufacturing substrate, method of manuf

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专利内容由知识产权出版社提供

专利名称:Method of manufacturing substrate,

method of manufacturing liquid ejectionhead, liquid ejection head and image formingapparatus

发明人:Hiroshi Ota申请号:US11493772申请日:20060727

公开号:US20070023960A1公开日:20070201

专利附图:

摘要:The method manufactures a substrate, and comprises the steps of: preparing a

first member having side faces in which recess parts are formed, and a second memberhaving flat surfaces; causing the flat surfaces of the second member to abut against theside faces of the first member in which the recess parts are formed so that one end ofeach of the recess parts is open to form an open end, and in this state, filling conductivepaste into the recess parts from the open ends of the recess parts; curing the conductivepaste filled in the recess parts; and separating the second member from the first

member on which conducting parts are formed from the cured conductive paste, whereinportions of exposed surfaces of the conducting parts that are exposed at the side facesof the first member are used as first electrodes, and end parts of the conducting partsthat correspond to the open ends used for filling the conductive paste, are used assecond electrodes.

申请人:Hiroshi Ota

地址:Ashigara-Kami-Gun JP

国籍:JP

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