Patterning method

专利名称：Patterning method发明人：Xiangjun Wang申请号：US105199申请日：20030707

公开号：US20060116001A1公开日：20060601

专利附图：

摘要：A method for patterning a device layer, for example of an organic electronic oroptoelectronic device, using a patterned stamp. The method comprising the steps of (a)providing a substrate, (b) bringing the patterned stamp into contact with the substrate,(c) removing the patterned stamp from the substrate, characterized in that step (b) is

carried out so that the surface energy of the substrate is modified in accordance with thepattern, and that the method further comprises a step (d) depositing a solution of adevice layer on the substrate after the patterned stamp has been removed, whereby thesurface energy of the substrate determines the deposition pattern of the device layer.

申请人：Xiangjun Wang

地址：Linkoeping SE

国籍：SE

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