PROCESS OF FABRICATING MICROFLUIDIC DEVICE CHIPS A

专利名称：PROCESS OF FABRICATING MICROFLUIDIC

DEVICE CHIPS AND CHIPS FORMEDTHEREBY

发明人：SPARKS, DOUGLAS, RAY申请号：EP09747424申请日：20090513公开号：EP2331454A4公开日：20141126

摘要：A process for fabricating multiple microfluidic device chips (50). The processincludes fabricating multiple micromachined tubes (52) in a semiconductor device wafer(12). The tubes (52) are fabricated so that each tube (52) has an internal fluidic passage(16) and an inlet and outlet (18) thereto defined in a surface of the device wafer (12). Thedevice wafer (12) is then bonded to a glass wafer (14) to form a device wafer stack (10),and so that through-holes (24) in the glass wafer (14) are individually fluidically coupledwith the inlets and outlets (18) of the tubes (52). The glass wafer (14) is then bonded to ametallic wafer (26) to form a package wafer stack, so that through-holes (30) in themetallic wafer (26) are individually fluidically coupled with the through-holes (24) of theglass wafer (14). Multiple microfluidic device chips (50) are then singulated from thepackage wafer stack. Each device chip (50) has a continuous flow path for a fluidtherethrough that is preferably free of organic materials.

申请人：INTEGRATED SENSING SYSTEMS, INC.

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