A PRINTED CIRCUIT BOARD ASSEMBLY WITH IMPROVED BYP

专利名称：A PRINTED CIRCUIT BOARD ASSEMBLY

WITH IMPROVED BYPASS DECOUPLING FORBGA PACKAGES

发明人：DRAKE, Michael,TRESSLER, Chris,GUERRERO,

Edward,SCHELLING, Greg,BENNETT, John

申请号：EP00990918.5申请日：20001121公开号：EP1260121A1公开日：20021127

摘要：A printed circuit board assembly with improved bypass decoupling for BGApackages. In one embodiment, a capacitor may be interposed between a BGA packageand a PCB within a perimeter of the contact pads that form a BGA footprint. Thecapacitor may have physical dimensions which allow a BGA package to be mounted suchthat there is no physical contact between the capacitor and the BGA.

申请人：ADVANCED MICRO DEVICES INC.

地址：One AMD Place,Mail Stop 68 Sunnyvale,California 94088-3453 US

国籍：US

代理机构：Sanders, Peter Colin Christopher

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