专利名称：IMPROVED HEAT SINKING METHODS FOR
PERFORMANCE AND SCALABILITY
发明人：FLINT, Terry, J.申请号：EP11807443.4申请日：20110713公开号：EP2593977A2公开日：20130522
摘要：A technique and apparatus for heat dissipation in electrical devices is described.A bulk body may be configured with a plurality of radiating devices so that the bulk bodymay be divided into smaller bulk bodies to be used in conjunction with other electricaltype assemblies to quickly and efficiently provide for a heat dissipation sub-assembly. Inone aspect, the bulk bodies may be configured with internal voids such as a duct ortunnel interconnecting at least one input port and at least one output port for aiding inheat dissipation of an electrical device employing bulk body technique.
申请人：Nexxus Lighting, Inc.
地址：124 Floyd Smith Drive, Suite 300 Charlotte, NC 28262 US
国籍：US
代理机构：Flutter, Paula
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